Hybrid Integration: Advancing Semiconductors, Quantum and Photonics. This project aims to establish an advanced on-demand precision micro-solder ball jetting to accelerate innovation in engineering of

Description

Hybrid Integration: Advancing Semiconductors, Quantum and Photonics. This project aims to establish an advanced on-demand precision micro-solder ball jetting to accelerate innovation in engineering of microelectronics, semiconductors, photonics and quantum systems. Expected outcomes include enhanced sovereign capability for Australia in advanced microelectronics and photonics subsystems assembly for critical imaging, sensing and communication applications. It will improve thermal imaging systems, increase digital fibre-optical telecommunications efficiency, enhance autonomous navigation capabilities and secure quantum and space communications, which will benefit multiple National Reconstruction Funds priority areas including medical science, defence capability, renewables, and enabling capabilities.. Scheme: Linkage Infrastructure, Equipment and Facilities. Field: 4009 - Electronics, Sensors and Digital Hardware. Lead: Prof Liyong Tong