Wireless Integrated Circuits for the Era of 6G: System-in-a-Package. The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon a

Description

Wireless Integrated Circuits for the Era of 6G: System-in-a-Package. The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovereign design capabilities. The results will constitute an important step towards implementing 6G. Benefits for Australia include the development of early career workers, generation of intellectual property, and securing social and economic benefits for Australians through application of this next-generation technology.. Scheme: ARC Future Fellowships. Field: 4009 - Electronics, Sensors and Digital Hardware. Lead: Dr Xi (Forest) Zhu