3D-Printed Antennas in Package for Millimetre-Wave Semiconductor Packaging. This project seeks to address key research challenges in millimetre-wave antenna-in-package technology for electronic packag

Description

3D-Printed Antennas in Package for Millimetre-Wave Semiconductor Packaging. This project seeks to address key research challenges in millimetre-wave antenna-in-package technology for electronic packaging by combining additively manufactured electronics with semiconductor chips. It targets an industry-wide knowledge gap in antenna-in-package beamforming, beam-steering, and thermal management. The proposed antenna-in-package approach provides a cost-effective, on-demand, and waste-reducing solution, enabling complex designs for compact electronic devices that traditional methods cannot support. The findings will offer valuable insights for antenna array packaging within the 5G frequency band. Additionally, the project aims to bolster Australia’s semiconductor industry by developing a local manufacturing ecosystem.. Scheme: Mid-Career Industry Fellowships. Field: 4006 - Communications Engineering. Lead: Prof Yang Yang